Daquan Xia

Publications

Citations

H-Index

2018

Active since

Affiliations

Huazhong University of Science and Technology(Current)

Chongqing University of Technology

Chongqing Vocational and Technical University of Mechatronics

Daquan Xia is an author at Huazhong University of Science and Technology specializing in materials science, electronic packaging, and mechanical engineering.

Top concepts

EngineeringMicrostructureMaterial ScienceElectronic PackagingMechanical EngineeringMechanics Of MaterialsHeat TransferSolid MechanicsThermal EngineeringStructural Materials

Publications per year

2018–2021

Publications

Fatigue cracking growth of SAC305 solder ball under rapid thermal shock

Cong Liu, Daquan Xia, Mizhe Tian et al. · Engineering Fracture Mechanics · 2021 · 17 citations

Materials Science, Engineering, Rapid Thermal Shock +9

Influence of thermal shock cycles on Sn-37Pb solder bumps

Guisheng Gan, Daquan Xia, Xin Liu et al. · Soldering and Surface Mount Technology · 2019 · 11 citations

Engineering, Mechanical Engineering, Thermal Shock +22

Ultrasonic-Assisted Soldering of Low-Ag SAC Lead-Free Solder Paste at Low-Temperature

Guisheng Gan, Linqiao Gan, Jizhao Guo et al. · MATERIALS TRANSACTIONS · 2018 · 10 citations · Full text

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