Jie Zheng

Wideband Modeling and Characterization of Differential Through-Silicon Vias for 3-D ICs

Wen‐Sheng Zhao, Jie Zheng, Feng Liang et al. · IEEE Transactions on Electron Devices · 2016 · 45 citations

Engineering, Silicon On Insulator, Interconnect (Integrated Circuits) +17

High-Frequency Analysis of Cu-Carbon Nanotube Composite Through-Silicon Vias

Wen‐Sheng Zhao, Jie Zheng, Yue Hu et al. · IEEE Transactions on Nanotechnology · 2016 · 41 citations

Materials Science, Electrical Engineering, Engineering +13

Transient Analysis of Through-Silicon Vias in Floating Silicon Substrate

Wen‐Sheng Zhao, Jie Zheng, Shichang Chen et al. · IEEE Transactions on Electromagnetic Compatibility · 2016 · 26 citations

3D Ic Architecture, Electrical Engineering, Engineering +14

Modeling and Characterization of Coaxial Through-Silicon Via With Electrically Floating Inner Silicon

Wen‐Sheng Zhao, Jie Zheng, Jing Wang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 22 citations

Device Modeling, Electrical Engineering, Nonlinear Capacitances +15

A Modular 0.18 um Analog / RFCMOS Technology Comprising 32 GHz FT RF-LDMOS and 40V Complementary MOSFET Devices

Zachary Lee, R. Zwingman, Jie Zheng et al. · Proceedings of the ... Bipolar/BiCMOS Circuits and Technology Meeting/Proceedings of the ... BipolarBiCMOS Circuits and Technology Meeting · 2006 · 16 citations

Low-power Electronics, Electrical Engineering, Engineering +12