Han-Byul Kang

Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process

Jeong‐Won Yoon, Jeong‐Won Yoon, Bo‐In Noh et al. · Journal of Alloys and Compounds · 2011 · 76 citations

Natural Sciences, Materials Engineering, Materials Science +14

Control of interfacial reaction layers formed in Sn–3.5Ag–0.7Cu/electroless Ni–P solder joints

Han-Byul Kang, Jee‐Hwan Bae, Jae‐Wook Lee et al. · Scripta Materialia · 2008 · 30 citations

Engineering, Materials Engineering, Materials Science +16

Characterization of ternary Ni2SnP layer in Sn–3.5Ag–0.7Cu/electroless Ni (P) solder joint

Han-Byul Kang, Jee‐Hwan Bae, Jeong‐Won Yoon et al. · Scripta Materialia · 2010 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +13

Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates

Han-Byul Kang, Jee‐Hwan Bae, Jae‐Wook Lee et al. · Journal of Electronic Materials · 2007 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +12

MORPHOLOGY, THERMAL STABILITY, AND SOLDERABILITY OF ELECTROLESS NICKEL–PHOSPHORUS PLATING LAYER

Jeong‐Won Yoon, Hyun-Suk Chun, Han-Byul Kang et al. · Surface Review and Letters · 2007 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +15