Zhaonian Cheng

Statistics

Publications

Citations

142

H-Index

Active since

2000

Affiliations

Shanghai Institute of Microsystem and Information Technology(Current)

Chinese Academy of Sciences

Daimler (Germany)

Zhaonian Cheng is an author at Shanghai Institute of Microsystem and Information Technology specializing in packaging engineering, materials engineering, and materials science.

Publications per year

2000–2002

Publications

The effects of underfill and its material models on thermomechanical behaviors of a flip chip package

Chen Liu, Qun Zhang, G.Z. Wang et al. · IEEE Transactions on Advanced Packaging · 2001 · 72 citations

Natural Sciences, Materials Engineering, Materials Science +17

Packaging effects on the performances of MEMS for high-G accelerometer with double-cantilevers

Weidong Huang, Xia Cai, Bulu Xu et al. · Sensors and Actuators A Physical · 2002 · 25 citations

Engineering, Electrical Engineering, Mechanical Engineering +12

The effects of underfill and its material models on thermomechanical behaviors of flip chip package

Zhaonian Cheng, Chen Liu, Xiaoming Xie et al. · 2002 · 17 citations

Natural Sciences, Materials Engineering, Materials Science +17

A study of moisture diffusion in plastic packaging

Xia Cai, Weidong Huang, Bulu Xu et al. · Journal of Electronic Materials · 2002 · 15 citations

Agriculture, Materials Engineering, Materials Science +14

On the degradation of the solder joints of underfilled flip chip packages: a case study

Chen Liu, Wang Guo-zhong, Zhaonian Cheng et al. · Soldering and Surface Mount Technology · 2000 · 13 citations

Engineering, Materials Engineering, Materials Science +17

1–5 of 5