Ziyue Zhang - Concepedia

Author

Ziyue Zhang

Beijing Institute of Technology ORCID

Also Known As

Zhang Ziyue, Zhang, Ziyue, Zi-Yue Zhang, Ziyue Zhang

Publications

651

Citations

H-Index

Concepts

All Affiliations

Beijing Institute of Technology Chinese Academy of Sciences Xidian University Zhejiang University Institute of Physics

About

Ziyue Zhang is an author at Beijing Institute of Technology specializing in engineering, materials science, and sensors.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	395
2	Applied Physics	1	1	28
3	Chemical Engineering	1	1	88
4	Chemistry	1	1	191
5	Computer Engineering	1	1	22

Ziyue Zhang

Publications

485

Citations

H-Index

Page 1

	Year	Citations
Ultrasensitive ppb-level NO2 gas sensor based on WO3 hollow nanosphers doped with Fe Ziyue Zhang, Mahmood Haq, Zhen Wen, Applied Surface Science Materials ScienceEngineeringSensorsNanomaterialsNanotechnology	2017	191
Fabrication of gas sensor based on mesoporous rhombus-shaped ZnO rod arrays Zhen Wen, Ziyue Zhang, Zhizhen Ye Sensors and Actuators B Chemical Materials ScienceChemical EngineeringEngineeringSensorsOxide Electronics	2014	88
Diode-pumped power scalable Kerr-lens mode-locked Yb:CYA laser Wenlong Tian, Yingnan Peng, Ziyue Zhang, Photonics Research Optical PumpingPhotonicsPulse GenerationStable 68Engineering	2018	43
Enabling Continuous Cu Seed Layer for Deep Through-Silicon-Vias With High Aspect Ratio by Sequential Sputtering and Electroless Plating Ziyue Zhang, Yingtao Ding, Lei Xiao, IEEE Electron Device Letters EngineeringElectroless PlatingThin Film Process TechnologyChemical DepositionSilicon On Insulator	2021	28
Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling Zhiqiang Cheng, Yingtao Ding, Ziyue Zhang, IEEE Access EngineeringMechanical EngineeringComputer-aided DesignIntegrated CircuitsComputational Mechanics	2020	22
Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration Xuyan Chen, Zhiming Chen, Lei Xiao, Micromachines	2022	17
Modeling and Characterization of Annealing-Induced Cu Protrusion of TSVs With Polyimide Liner Considering Diffusion Creep Behavior Baoyan Yang, Yingtao Ding, Zhiqiang Cheng, IEEE Transactions on Electron Devices	2022	17
An ultra-deep TSV technique enabled by the dual catalysis-based electroless plating of combined barrier and seed layers Yuwen Su, Yingtao Ding, Lei Xiao, Microsystems & Nanoengineering	2024	15
An Yb-fiber frequency comb phase-locked to microwave standard and optical reference* Huibo Wang, Hainian Han, Ziyue Zhang, Chinese Physics B PhotonicsEngineeringRadio Frequency ReferenceOptical PropertiesFiber-optic Communication	2020	12
Ultra-Deep Annular Cu Through-Silicon-Vias Fabricated Using Single-Sided Process Lei Xiao, Yingtao Ding, Yuwen Su, IEEE Electron Device Letters	2022	11

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