Concepedia

Seogmoon Choi

SC

Statistics

Publications

6

Citations

140

H-Index

6

Active since

2006

Affiliations

Samsung (South Korea)(Current)

Seogmoon Choi is an author at Samsung (South Korea) specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingHeat TransferThermal EngineeringElectrical EngineeringReliabilityMaterial ScienceMicroelectronicsThermal ModelingComputer Engineering

Publications per year

2006–2012

6

Publications

6

Large Displacement Polymer Bimorph Actuator for Out-of-Plane Motion

Won-Kyu Jeung, Seogmoon Choi, Yong-Jun Kim · Journal of Electrical Engineering and Technology · 2006 · 39 citations · Full text

Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die

Seon Young Yu, Yongmin Kwon, Jinsu Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 37 citations

Engineering, Mechanical Engineering, Reliability Engineering +20

Design optimization on the heat transfer and mechanical reliability of High Brightness Light Emitting Diodes (HBLED) package

Shan Gao, Ju‐Pyo Hong, Sanghyun Shin et al. · 2008 · 21 citations

Engineering, Thermal Resistance Measurement, Advanced Packaging (Semiconductors) +18

Issues in junction-to-case thermal characterization of power packages with large surface area

András Vass-Várnai, Shan Gao, Zoltán Sárkány et al. · 2010 · 16 citations · Full text

Engineering, Energy Efficiency, Interconnect (Integrated Circuits) +20

LED packaging using high sag rectangular microlens array

Chang-Hyun Lim, Won-Kyu Jeung, Seogmoon Choi · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2006 · 15 citations

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