Z.F. Wang

Effects of Sb addition on tensile strength of Sn–3.5Ag–0.7Cu solder alloy and joint

G.Y. Li, B.L. Chen, Xu Shi et al. · Thin Solid Films · 2005 · 62 citations

Materials Science, Engineering, Mechanical Engineering +6

Development of 1 × 4 MEMS-based optical switch

Z.F. Wang, Wen-Jun Cao, Xuechuan Shan et al. · Sensors and Actuators A Physical · 2004 · 31 citations

Photonics, Electrical Engineering, Optical Materials +8

Chemical mechanical polishing of polymeric materials for MEMS applications

Z.W. Zhong, Z.F. Wang, Yew Heng Tan · Microelectronics Journal · 2005 · 28 citations

MEMS vacuum packaging technology and applications

Yi Jin, Z.F. Wang, P. C. Lim et al. · 2004 · 28 citations

Advanced Packaging, Electrical Engineering, Mems Devices +15

Microstructure of eutectic 80Au/20Sn solder joint in laser diode package

J. W. Ronnie Teo, Fern Lan Ng, L.S. Goi et al. · Microelectronic Engineering · 2007 · 27 citations

Materials Engineering, Materials Science, Advanced Laser Processing +12