G.Y. Li

Influence of Sb on IMC growth in Sn–Ag–Cu–Sb Pb-free solder joints in reflow process

B.L. Chen, G.Y. Li · Thin Solid Films · 2004 · 97 citations

Materials Science, Materials Engineering, Imc Growth +3

Formation and growth kinetics of interfacial intermetallics in Pb-free solder joint

G.Y. Li, B.L. Chen · IEEE Transactions on Components and Packaging Technologies · 2003 · 63 citations

Friction Welding, Engineering, Lead-free Solder +18

Effects of Sb addition on tensile strength of Sn–3.5Ag–0.7Cu solder alloy and joint

G.Y. Li, B.L. Chen, Xu Shi et al. · Thin Solid Films · 2005 · 62 citations

Materials Science, Engineering, Mechanical Engineering +6

An investigation of effects of Sb on the intermetallic formation in Sn-3.5Ag-0.7Cu solder joints

B.L. Chen, G.Y. Li · IEEE Transactions on Components and Packaging Technologies · 2005 · 57 citations

Materials Engineering, Materials Science, Friction Welding +15

Reaction of Sn-3.5Ag-0.7Cu-xSb solder with Cu metallization during reflow soldering

G.Y. Li, B.L. Chen, Ju Nie Tey · IEEE Transactions on Electronics Packaging Manufacturing · 2004 · 49 citations

Materials Science, Materials Engineering, Chemical Engineering +12