Marc van Cauwenberghe

3D stacked IC demonstration using a through Silicon Via First approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · 2008 · 141 citations

Engineering, Computer Engineering, Electrical Engineering +17

3D stacked IC demonstration using a through silicon via first approach

J. Van Olmen, A. Mercha, Guruprasad Katti et al. · VUBIR (Vrije Universiteit Brussel) · 2011 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +17

Enabling 10µm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias

Cedric Huyghebaert, J. Van Olmen, Okoro Chukwudi et al. · 2010 · 12 citations

Engineering, Manufacturing Engineering, Materials Science +17