Yanmei Kong

Embedded cooling method with configurability and replaceability for multi-chip electronic devices

Nan Zhang, Binbin Jiao, Yuxin Ye et al. · Energy Conversion and Management · 2021 · 122 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +14

Experimental investigations on the thermal superposition effect of multiple hotspots for embedded microfluidic cooling

Yuxin Ye, Binbin Jiao, Yanmei Kong et al. · Applied Thermal Engineering · 2021 · 72 citations

Heat Transfer Process, Engineering, Liquid Metal Cooling +10

A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control

Bo Cong, Yanmei Kong, Yuxin Ye et al. · Applied Thermal Engineering · 2022 · 47 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +13

Active Thermal Management of GaN-on-SiC HEMT With Embedded Microfluidic Cooling

Yuxin Ye, Mei Wu, Yanmei Kong et al. · IEEE Transactions on Electron Devices · 2022 · 37 citations

Engineering, Liquid Metal Cooling, Junction Cooling +17

Low Stress TSV Arrays for High-Density Interconnection

Binbin Jiao, Jingping Qiao, Shiqi Jia et al. · Engineering · 2024 · 32 citations · Full text

Materials Science, Advanced Packaging, Electrical Engineering +13