Kun Peng

A 0.18 μm foundry RF CMOS technology with 70 GHz F/sub t/ for single chip system solutions

Heng-Ming Hsu, Jui-Yu Chang, Jiong-Guang Su et al. · 2002 · 26 citations

Engineering, Electrical Engineering, Microelectronics +16

Superhydrophobic Electrospun PI/PTFE Membranes with Ultralow Dielectric Constants for High-Frequency Telecommunication

Azim Abdullaev, Xiangyu Mei, Fujian Liu et al. · ACS Applied Materials & Interfaces · 2024 · 26 citations

Engineering, Materials Engineering, Materials Science +17

Using erase self-detrapped effect to eliminate the flash cell program/erase cycling V/sub th/ window close

J.H. Lee, Kun Peng, J.R. Shih et al. · 2003 · 16 citations

Engineering, Computer Engineering, Electrical Engineering +15

Electrospinning-impregnation: Producing hydrophobic polyimide composites with superior dielectric properties

Xiangyu Mei, Kun Peng, Feiyan Wu et al. · Composites Science and Technology · 2024 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +13

The Sandwich Structure of a Polyimide/PTFE Composite Film Designed to Achieve a Low Dielectric Constant and Excellent Thermal Performance at High Frequency

Kun Peng, Xinyan Yang, Md Zahidul Islam et al. · ACS Applied Polymer Materials · 2024 · 13 citations

Natural Sciences, Materials Engineering, Materials Science +17