J. A. Tornello

FinFET performance advantage at 22nm: An AC perspective

Michael Guillorn, Josephine Chang, A. Bryant et al. · 2008 · 83 citations

Device Modeling, Electrical Engineering, Engineering +11

Electrochemical process for advanced package fabrication

S. Krongelb, L. T. Romankiw, J. A. Tornello · IBM Journal of Research and Development · 1998 · 34 citations

Engineering, Polyimide Backfill, Package Structure +20

Simultaneous fabrication of RF MEMS switches and resonators using copper-based CMOS interconnect manufacturing methods

C. Jahnes, J. Cotte, Jennifer L. Lund et al. · 2004 · 24 citations

Engineering, Device Integration, Simultaneous Fabrication +16

Integrated, variable-reluctance magnetic minimotor

E. J. O’Sullivan, Emanuel I. Cooper, L. T. Romankiw et al. · IBM Journal of Research and Development · 1998 · 22 citations

Electric Machine, Engineering, Motor Drive +18

A metal-oxide-semiconductor field-effect transistor with a 20-nm channel length

A. Hartstein, Neil F. Albert, A. A. Bright et al. · Journal of Applied Physics · 1990 · 18 citations

Electrical Engineering, Sio2 Gate Oxide, Engineering +10