Tianming Ni - Concepedia

Author

Tianming Ni

Anhui Polytechnic University ORCID

Also Known As

Ni Tianming, Ni, Tianming, T T Ni, T. Ni, Tai Song, Tianming NI, Tianming Ni, Tonglie Ni

147

Publications

1.7K

Citations

H-Index

Concepts

All Affiliations

Anhui Polytechnic University Hefei University of Technology Anhui University Kyushu Institute of Technology Laboratoire d'Informatique, de Robotique et de Microélectronique de Montpellier

About

Tianming Ni is an author at Anhui Polytechnic University specializing in engineering, computer engineering, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	24	30	1.3K
2	Computer Engineering	21	26	1.2K
3	Applied Physics	4	4	179
4	Chemical Engineering	2	2	70
5	Education	1	1	24

Tianming Ni

Publications

1.4K

Citations

H-Index

Page 1

	Year	Citations
Architecture of Cobweb-Based Redundant TSV for Clustered Faults Tianming Ni, Dongsheng Liu, Qi Xu, IEEE Transactions on Very Large Scale Integration (VLSI) Systems Cluster ComputingEngineeringComputer ArchitectureEfficient HardwareInterconnect (Integrated Circuits)	2020	149
Information Assurance Through Redundant Design: A Novel TNU Error-Resilient Latch for Harsh Radiation Environment Aibin Yan, Yuanjie Hu, Jie Cui, IEEE Transactions on Computers Non-volatile MemoryEngineeringVlsi DesignInformation SecurityComputer Architecture	2020	92
Novel Quadruple-Node-Upset-Tolerant Latch Designs With Optimized Overhead for Reliable Computing in Harsh Radiation Environments Aibin Yan, Zhelong Xu, Xiangfeng Feng, IEEE Transactions on Emerging Topics in Computing Nano-scale Cmos LatchesEngineeringVlsi DesignComputer ArchitectureReliable Computing	2020	79
Novel Speed-and-Power-Optimized SRAM Cell Designs With Enhanced Self-Recoverability From Single- and Double-Node Upsets Aibin Yan, Yan Chen, Yuanjie Hu, IEEE Transactions on Circuits and Systems I Regular Papers Non-volatile MemoryEngineeringVlsi DesignComputer ArchitecturePossible Snus	2020	69
LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults Tianming Ni, Yao Yao, Hao Chang, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems Cluster ComputingEngineeringComputer ArchitectureFault ToleranceInterconnect (Integrated Circuits)	2019	68
Design of True Random Number Generator Based on Multi-Stage Feedback Ring Oscillator Jianguo Cui, Maoxiang Yi, Di Cao, IEEE Transactions on Circuits & Systems II Express Briefs Hardware SecurityElectrical EngineeringEngineeringClock SignalHigh-frequency Device	2021	58
Quadruple and Sextuple Cross-Coupled SRAM Cell Designs With Optimized Overhead for Reliable Applications Aibin Yan, Jing Xiang, Aoran Cao, IEEE Transactions on Device and Materials Reliability Hardware SecurityElectrical EngineeringEngineeringVlsi DesignAggressive Technology	2022	58
A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology Tianming Ni, Zhao Yang, Hao Chang, IEEE Transactions on Emerging Topics in Computing Hardware Security3D Ic ArchitectureElectrical EngineeringPhysical Design (Electronics)Engineering	2020	52
Two Double-Node-Upset-Hardened Flip-Flop Designs for High-Performance Applications Aibin Yan, Aoran Cao, Zhengfeng Huang, IEEE Transactions on Emerging Topics in Computing EngineeringVlsi DesignComputer ArchitectureHardware SecurityAdvanced Packaging (Semiconductors)	2023	52
Non-Intrusive Online Distributed Pulse Shrinking-Based Interconnect Testing in 2.5D IC Tianming Ni, Hao Chang, Tai Song, IEEE Transactions on Circuits & Systems II Express Briefs Electrical EngineeringReliability EngineeringEngineeringVlsi DesignFault Detection	2019	51

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