Yusuke Matsuda

Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC:H thin films

Sean W. King, Jeff Bielefeld, Guanghai Xu et al. · Journal of Non-Crystalline Solids · 2013 · 83 citations

Materials Science, Electrical Engineering, Engineering +8

Fundamental limits of material toughening in molecularly confined polymers

Scott G. Isaacson, Krystelle Lionti, Willi Volksen et al. · Nature Materials · 2015 · 62 citations

Materials Science, Engineering, Polymer Science +5

Fracture properties of hydrogenated amorphous silicon carbide thin films

Yusuke Matsuda, Sean W. King, Jeff Bielefeld et al. · Acta Materialia · 2011 · 34 citations

Materials Science, Engineering, Applied Physics +5

Moisture-Insensitive Polycarbosilane Films with Superior Mechanical Properties

Yusuke Matsuda, Jitendra S. Rathore, Leonard V. Interrante et al. · ACS Applied Materials & Interfaces · 2012 · 33 citations

Materials Science, Superior Mechanical Properties, Polymer Material +13

Effect of Cu powder addition on thermoelectric properties of Cu/TiO 2−x composites

Yun Lu, Katsuhiro Sagara, Yusuke Matsuda et al. · Ceramics International · 2013 · 28 citations

Materials Science, Engineering, Cu Powder Addition +7