Collin Fleshman

Improving thermal shock response of interfacial IMCs in Sn–Ag–Cu joints by using ultrathin-Ni/Pd/Au metallization in 3D-IC packages

Tzu-Ting Chou, Collin Fleshman, Hao Chen et al. · Journal of Materials Science Materials in Electronics · 2018 · 16 citations

Materials Science, Materials Engineering, Engineering +10

Investigating the Effect of Ag Content on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints

Hao Chen, Tzu-Ting Chou, Collin Fleshman et al. · Journal of Electronic Materials · 2019 · 16 citations

Materials Engineering, Materials Science, Friction Welding +7

The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint

Collin Fleshman, Wei-Yu Chen, Tzu-Ting Chou et al. · Materials Chemistry and Physics · 2016 · 15 citations

Materials Science, Engineering, Severe Plastic Deformation +9

Diversifying grain orientation and expediting 10 μm Cu/Sn/Cu TLP bonding process with Ni doping

Yu-Ching Wang, Collin Fleshman, Rui-Wen Song et al. · Journal of Materials Science Materials in Electronics · 2021 · 15 citations

Materials Science, Materials Engineering, Material Analysis +7

Suppressing interfacial voids in Cu/In/Cu microbump with Sn and Cu addition

Rui-Wen Song, Collin Fleshman, Hao Chen et al. · Materials Letters · 2019 · 11 citations

Materials Science, Cu Addition, Cu/in/cu Microbump +5