Tzu-Ting Chou

Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy

Tzu-Ting Chou, Rui-Wen Song, Wei-Yu Chen et al. · Materials Letters · 2018 · 27 citations

Materials Science, Materials Engineering, Friction Welding +11

Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu– x Zn microbumps and Zn-doped solder joints

Wei-Yu Chen, Wei Tu, Hsiang-Ching Chang et al. · Materials Letters · 2014 · 20 citations

Materials Engineering, Materials Science, Zn-doped Solder Joints +7

Improving thermal shock response of interfacial IMCs in Sn–Ag–Cu joints by using ultrathin-Ni/Pd/Au metallization in 3D-IC packages

Tzu-Ting Chou, Collin Fleshman, Hao Chen et al. · Journal of Materials Science Materials in Electronics · 2018 · 16 citations

Materials Science, Materials Engineering, Engineering +10

Investigating the Effect of Ag Content on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints

Hao Chen, Tzu-Ting Chou, Collin Fleshman et al. · Journal of Electronic Materials · 2019 · 16 citations

Materials Engineering, Materials Science, Friction Welding +7

The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint

Collin Fleshman, Wei-Yu Chen, Tzu-Ting Chou et al. · Materials Chemistry and Physics · 2016 · 15 citations

Materials Science, Engineering, Severe Plastic Deformation +9