Yu-Ching Wang

Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging

Zih-You Wu, Tzu-Chia Wang, Yu-Ching Wang et al. · Journal of Materials Science Materials in Electronics · 2022 · 17 citations

Natural Sciences, Materials Engineering, Materials Science +12

Diversifying grain orientation and expediting 10 μm Cu/Sn/Cu TLP bonding process with Ni doping

Yu-Ching Wang, Collin Fleshman, Rui-Wen Song et al. · Journal of Materials Science Materials in Electronics · 2021 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +9

Applying unsupervised learning method to develop a regional risk model based on TCFD: A case study in the United States

Ming‐Chuan Chiu, Chia-Jung Wei, Yu-Ching Wang et al. · Journal of Cleaner Production · 2023 · 13 citations

Business, Regional Planning, Risk Management +12

IMC suppression and phase stabilization of Cu/Sn-Bi/Cu microbump via Zn doping

Rui-Wen Song, Collin Fleshman, Yu-Ching Wang et al. · Materials Letters · 2020 · 10 citations

Engineering, Materials Engineering, Materials Science +8