Concepedia

Tzu-Chia Wang

TW

Statistics

Publications

1

Citations

17

H-Index

1

Active since

2022

Affiliations

National Tsing Hua University(Current)

Tzu-Chia Wang is an author at National Tsing Hua University specializing in electronic packaging, applied physics, and materials engineering.

Top concepts

EngineeringMicrostructureApplied PhysicsMaterial ScienceMicroelectronicsAdvanced PackagingElectronic PackagingMaterials EngineeringMechanical PropertiesMechanical Engineering

Publications per year

2022–2022

1

Publications

1

Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging

Zih-You Wu, Tzu-Chia Wang, Yu-Ching Wang et al. · Journal of Materials Science Materials in Electronics · 2022 · 17 citations

Advanced Packaging, Materials Science, Materials Engineering +13

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