Eckhard Langer

In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures

Michael Meyer, Mathias Herrmann, Eckhard Langer et al. · Microelectronic Engineering · 2002 · 95 citations

Materials Science, Electrical Engineering, Electromigration Technique +10

Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation

Ehrenfried Zschech, Moritz Andreas Meyer, Eckhard Langer · MRS Proceedings · 2004 · 32 citations

Materials Science, Mass Transport, Electromigration Technique +11

Physical failure analysis in semiconductor industry—challenges of the copper interconnect process

Ehrenfried Zschech, Eckhard Langer, Hans-Juergen Engelmann et al. · Materials Science in Semiconductor Processing · 2002 · 25 citations

Reliability, Electrical Engineering, Reliability Engineering +9

Conduction and material transport phenomena of degradation in electrically stressed ultra low-k dielectric before breakdown

Thomas Breuer, U. Kerst, Christian Boit et al. · Journal of Applied Physics · 2012 · 15 citations

Engineering, Tantalum Transport, Nanoelectronics +18