Concepedia

In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures

Michael Meyer, Mathias Herrmann, Eckhard Langer, Ehrenfried Zschech

Microelectronic Engineering · 2002 · 96 citations · 2 references

Concepts

EngineeringElectrical EngineeringMaterials EngineeringElectronic MaterialsMetallic MaterialsSemiconductor DevicesElectric CircuitsElectrical ConductivityIntegrated Circuit FabricationInterconnect DesignInterconnect TechnologyMetal-semiconductor ContactsCopper InterconnectsElectromigrationElectromigration AnalysisElectromigration ReliabilityInterconnect CharacterizationInterconnect FabricationInterconnect Materials

References

2

Relationship between microstructure and electromigration damage in unpassivated PVD copper damascene interconnects

T.G. Koetter, H. Wendrock, H. Schuehrer et al. · Microelectronics Reliability · 2000 · 27 citations

Engineering, Materials Engineering, Materials Science +10

Local textures and grain boundaries in voided copper interconnects

Robert R. Keller, J. A. Nucci, David P. Field · Journal of Electronic Materials · 1997 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +16