Concepedia

Dongfan Wang

DW

4

Publications

87

Citations

4

H-Index

2017

Active since

Affiliations

Shanghai Jiao Tong University(Current)

Chinese Academy of Sciences

Institute of Microelectronics

Dongfan Wang is an author at Shanghai Jiao Tong University specializing in materials science, microstructure, and engineering.

Top concepts

EngineeringMicrostructureMaterial ScienceApplied PhysicsMicrofabricationMaterials EngineeringBusinessChemistryManagementMarket Design

Publications per year

2017–2021

4

Publications

4

Growth behavior of tin whisker on SnAg microbump under compressive stress

Menglong Sun, Mengya Dong, Dongfan Wang et al. · Scripta Materialia · 2018 · 35 citations

Materials Science, Growth Behavior, Engineering +5

The opportunity study of PM strategy for second-hand products sold with a two-dimensional warranty

Anshu Dai, Guanzhou Wei, Dongfan Wang et al. · Reliability Engineering & System Safety · 2021 · 27 citations

Two-dimensional Warranty, Management, Business +11

Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps

Dongfan Wang, Huiqin Ling, Menglong Sun et al. · Journal of Materials Science Materials in Electronics · 2017 · 14 citations

Materials Science, Materials Engineering, Voids Growth +9

Effects of Sn grain size on intermetallic compounds formation in 5 µm diameter Cu/Sn pillar bumps

Kai Chen, Dongfan Wang, Huiqin Ling et al. · Journal of Materials Science Materials in Electronics · 2018 · 11 citations

Materials Engineering, Sn Grain Size, Materials Science +6

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