Mengya Dong

Effects of 2-mercaptopyridine and Janus Green B as levelers on electrical resistance of electrodeposited copper thin film for interconnects

Yumei Zhang, Tao Hang, Mengya Dong et al. · Thin Solid Films · 2019 · 49 citations

Materials Science, Electrical Resistance, Electrical Engineering +9

Growth behavior of tin whisker on SnAg microbump under compressive stress

Menglong Sun, Mengya Dong, Dongfan Wang et al. · Scripta Materialia · 2018 · 35 citations

Materials Science, Growth Behavior, Engineering +5

Design of thermally stable insulation film by radical grafting poly(methylacrylic acid) on silicon surface

Yang Liu, Mengya Dong, Tanyanyu Wang et al. · Applied Surface Science · 2018 · 28 citations

Materials Science, Engineering, Thermal Protection +13

Structural effect of inhibitors on adsorption and desorption behaviors during copper electroplating for through-silicon vias

Mengya Dong, Yumei Zhang, Tao Hang et al. · Electrochimica Acta · 2021 · 23 citations

Materials Engineering, Materials Science, Chemical Engineering +10

Mitigation of tin whisker growth by inserting Ni nanocones

Menglong Sun, Xiaoping Long, Mengya Dong et al. · Materials Characterization · 2017 · 21 citations

Materials Science, Engineering, Nanomaterials +3