Publication | Closed Access

Structural effect of inhibitors on adsorption and desorption behaviors during copper electroplating for through-silicon vias

Materials EngineeringMaterials ScienceChemical EngineeringStructural EffectEngineeringSurface ElectrochemistrySurface ScienceDesorption BehaviorsChemisorptionChemistryElectrochemical InterfaceElectrochemistryThrough-silicon Vias