Publication | Closed Access
Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps
14
Citations
24
References
2017
Year
Materials ScienceMaterials EngineeringVoids GrowthEngineeringFine-pitch Sn–3.5ag/ni/cu MicrobumpsMicrofabricationSurface ScienceApplied PhysicsMetallurgical InteractionChemistryIntermetallic CompoundMicrostructure
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