Scott Ageno

Low‐temperature amorphous‐silicon backplane technology development for flexible displays in a manufacturing pilot‐line environment

Gregory B. Raupp, Shawn M. O’Rourke, Curt Moyer et al. · Journal of the Society for Information Display · 2007 · 56 citations

Engineering, Integrated Circuits, Display‐scale Pilot Line +18

Temporary bond-debond process for manufacture of flexible electronics: Impact of adhesive and carrier properties on performance

Jesmin Haq, Scott Ageno, Gregory B. Raupp et al. · Journal of Applied Physics · 2010 · 35 citations

Temporary Bond-debond Method, Engineering, Mechanical Engineering +24

Choosing an optimum large signal model for GaAs MESFETs and HEMTs

M. Miller, Mike Golio, B. Beckwith et al. · 2002 · 23 citations

Device Modeling, Electrical Engineering, Semiconductor Device +12

65.4: Active Matrix PHOLED Displays on Temporary Bonded Polyethylene Naphthalate Substrates with 180 °C a‐Si:H TFTs

Doug Loy, Yong Kyun Lee, Cynthia S. Bell et al. · SID Symposium Digest of Technical Papers · 2009 · 19 citations

Registration Distortion, H Tfts, Engineering +17

Diffusion of zinc into Ga1−<i>x</i>Al<i>x</i>As

Scott Ageno, R. J. Roedel, N. Mellen et al. · Applied Physics Letters · 1985 · 17 citations

Materials Science, Point Defects, Engineering +7