Olaf Wünsch

TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

Kai Zoschke, J.K. Wolf, Christina Lopper et al. · 2011 · 61 citations

Engineering, Silicon Vias, Sip Modules +20

Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration

Kai Zoschke, Matthias Wegner, Martin Wilke et al. · 2010 · 34 citations

Numerical simulation of 3d viscous fluid flow and convective mixing in a static mixer

Olaf Wünsch, G. Böhme · Archive of Applied Mechanics · 2000 · 21 citations

Viscous Fluid Flow, Static Mixer, Engineering +8

Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer Technology

Kai Zoschke, Thorsten Fischer, Michael J. Topper et al. · IEEE Transactions on Advanced Packaging · 2010 · 20 citations

Engineering, Integrated Coils, Interconnect (Integrated Circuits) +16

Analysis of shear-thinning fluid flow in intermeshing twin-screw extruders

G. Böhme, Olaf Wünsch · Archive of Applied Mechanics · 1997 · 15 citations

Rheological Measurement, Viscoplastic Fluid, Engineering +5