Hsiao‐Chun Huang

Influence of Convection-Dependent Adsorption of Additives on Microvia Filling by Copper Electroplating

Wei‐Ping Dow, Her-Shu Huang, Ming-Yao Yen et al. · Journal of The Electrochemical Society · 2005 · 208 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Filling mechanism in microvia metallization by copper electroplating

Wei‐Ping Dow, Ming-Yao Yen, Sian-Zong Liao et al. · Electrochimica Acta · 2008 · 129 citations

Engineering, Materials Engineering, Materials Science +14

Development and characterization of new generation panel fan-out (P-FO) packaging technology

Hong-Da Chang, David Chang, Kenny Liu et al. · 2014 · 56 citations

Engineering, Electrical Engineering, Microfabrication +15

Construction of intracellular asymmetry and asymmetric division in Escherichia coli

Dawei Lin, Yang Liu, Yue-Qi Lee et al. · Nature Communications · 2021 · 35 citations · Full text

Life Sciences, Cell Biology, Microbiology +15

Efficient Generation of Chemically Induced Mesenchymal Stem Cells from Human Dermal Fibroblasts

Pei‐Lun Lai, Hsuan Lin, Shang‐Fu Chen et al. · Scientific Reports · 2017 · 34 citations · Full text

Life Sciences, Biotechnology, Cell Biology +16