Analysis and mitigation of interface losses in trenched superconducting coplanar waveguide resonators

Greg Calusine, Alexander Melville, Wayne Woods, +12

Applied Physics Letters

Solid-State Qubits: 3D Integration and Packaging

Danna Rosenberg, Steven Weber, David Conway, +9

IEEE Microwave Magazine

Quantum SoftwareEngineeringComputational ChemistryQuantum ProcessorQuantum Processing +17

CMOS millimeter wave phase shifter based on tunable transmission lines

Wayne Woods, Alberto Valdes‐Garcia, Hanyi Ding, +1

Electrical EngineeringTunable Transmission LineEngineeringRadio FrequencyMicrowave Transmission +8

3D integration and packaging for solid-state qubits

D. Rosenberg, Steven Weber, David Conway, +9

arXiv (Cornell University)

Materials ScienceQuantum Science3D Ic ArchitectureEngineeringQuantum Computing +13

A 18mW, 3.3dB NF, 60GHz LNA in 32nm SOI CMOS technology with autonomic NF calibration

Jean‐Olivier Plouchart, F. Wang, Andreea Balteanu, +9

Low-power ElectronicsElectrical EngineeringMillimeter Wave TechnologyEngineeringVlsi Design +11

A new on-wafer de-embedding technique for on-chip rf transmission line interconnect characterization

Y. Tretiakov, K. Vaed, Wayne Woods, +2

Neural-network-based parasitic modeling and extraction verification for RF/millimeter-wave integrated circuit design

Padmanava Sen, Wayne Woods, S. Sarkar, +6

IEEE Transactions on Microwave Theory and Techniques

EngineeringIntegrated CircuitsLayout Generation MethodologyInterconnect (Integrated Circuits)Electromagnetic Compatibility +18

Fabrication of superconducting through-silicon vias

Justin Mallek, D. Yost, Danna Rosenberg, +15

arXiv (Cornell University)

Superconducting MaterialEngineeringQubit CoherenceInterconnect (Integrated Circuits)Quantum Computing +17

On wafer de-embedding for SiGe/BiCMOS/RFCMOS transmission line interconnect characterization

Y. Tretiakov, K. Vaed, D. Ahlgren, +3

Electrical EngineeringExtracted Electrical CharacteristicsEngineeringAdvanced Packaging (Semiconductors)Chip On Board +11

Microwave Packaging for Superconducting Qubits

Benjamin Lienhard, Jochen Braumüller, Wayne Woods, +8

Superconducting MaterialEngineeringPersistent Engineering ChallengesQuantum EngineeringJosephson Junctions +22