William R. Entley - Concepedia

Concepedia

Author

William R. Entley

University of Illinois Urbana-Champaign

Also Known As

W. R. ENTLEY, W. R. Entley, William R. Entley

13

Publications

1.1K

Citations

9

H-Index

38

Concepts

All Affiliations

University of Illinois Urbana-Champaign Air Products (United States)

WR

About

William R. Entley is an author at University of Illinois Urbana-Champaign specializing in engineering, materials science, and chemistry.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	443
2	Chemistry	4	4	363
3	Applied Physics	3	3	336
4	Natural Sciences	2	2	288
5	Chemical Engineering	2	2	47

William R. Entley

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9

Publications

1.1K

Citations

9

H-Index

	Year	Citations
High-Temperature Molecular Magnets Based on Cyanovanadate Building Blocks: Spontaneous Magnetization at 230 K William R. Entley, Gregory S. Girolami Science	1995	622
New Three-Dimensional Ferrimagnetic Materials: K2Mn[Mn(CN)6], Mn3[Mn(CN)6]2.cntdot.12H2O, and CsMn[Mn(CN)6].cntdot.1/2H2O William R. Entley, Gregory S. Girolami Inorganic Chemistry Materials ScienceMagnetismFerromagnetismMagnetic PropertiesEngineering	1994	207
Molecular Magnets Constructed from Cyanometalate Building Blocks William R. Entley, Christopher R. Treadway, Gregory S. Girolami Molecular crystals and liquid crystals science technology. Section A, Molecular crystals and liquid crystals/Molecular crystals and liquid crystals science and technology. Section A, Molecular crystals and liquid crystals Magnetic PropertiesEngineeringLow-dimensional MagnetismMagnetic SolidsMagnetic Resonance	1995	81
High-density plasma patterning of low dielectric constant polymers: A comparison between polytetrafluoroethylene, parylene-N, and poly(arylene ether) T. E. F. M. Standaert, P. J. Matsuo, X. Li, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films EngineeringPattern TransferInterlayer DielectricsVacuum DeviceHigh-density Plasma Patterning	2001	48
The Hexacyanotitanate Ion: Synthesis and Crystal Structure of [NEt<sub>4</sub>]<sub>3</sub>[Ti<sup>III</sup>(CN)<sub>6</sub>]·4MeCN William R. Entley, Christopher R. Treadway, Scott R. Wilson, Journal of the American Chemical Society Materials ScienceInorganic ChemistryCrystal StructureEngineeringCoordination Complex	1997	43
Gas utilization in remote plasma cleaning and stripping applications B. E. E. Kastenmeier, G. S. Oehrlein, J.G. Langan, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Chemical EngineeringEngineeringEnergy EfficiencyPfc GasesMass Spectrometry	2000	32
Optimizing utilization efficiencies in electronegative discharges: The importance of the impedance phase angle William R. Entley, J.G. Langan, B. Felker, Journal of Applied Physics Electrical EngineeringEngineeringGlow DischargeUtilization EfficienciesC2f6 Ues	1999	17
C[sub 2]F[sub 6]/O[sub 2] and C[sub 3]F[sub 8]/O[sub 2] Plasmas SiO[sub 2] Etch Rates, Impedance Analysis, and Discharge Emissions William R. Entley Electrochemical and Solid-State Letters Chemical EngineeringElectrical EngineeringEngineeringElectrochemical SocietyFastest Etch Rates	1999	15
The torsional dependence of an interaction potential: the CH3OHHe system Stephen L. Davis, William R. Entley Chemical Physics	1992	11

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