Shoichi Suenaga

Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In

Guang Zeng, Stuart D. McDonald, Qinfen Gu et al. · Intermetallics · 2013 · 59 citations

Materials Engineering, Materials Science, Engineering +7

The influence of solder composition on the impact strength of lead-free solder ball grid array joints

Hideaki Tsukamoto, T. Nishimura, Shoichi Suenaga et al. · Microelectronics Reliability · 2010 · 51 citations

Materials Science, Engineering, Solder Composition +2

Microstructure Control in Sn–0.7 mass%Cu Alloys

Kazuhiro Nogita, J. Read, Tetsuro Nishimura et al. · MATERIALS TRANSACTIONS · 2005 · 49 citations · Full text

Materials Science, Materials Engineering, Solidification Behaviour +13

Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-based Lead-free Solders

Kazuhiro Nogita, Stuart D. McDonald, Hideaki Tsukamoto et al. · Transactions of The Japan Institute of Electronics Packaging · 2009 · 46 citations · Full text

Engineering, Sn-based Lead-free Solders, Structural Materials +18

Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

Hideaki Tsukamoto, T. Nishimura, Shoichi Suenaga et al. · Materials Science and Engineering B · 2010 · 37 citations

Materials Science, Materials Engineering, Engineering +7