J.A.H. van Gerven is an author at Philips (Netherlands) specializing in electronic packaging, surface science, and solid mechanics.
Top concepts
EngineeringHeat TransferMicrostructureApplied PhysicsSolid MechanicsSurface ScienceMaterial ScienceMicrofabricationElectronic PackagingMechanical Engineering
Publications per year
1989–1989
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