IR sensitivity enhancement of CMOS Image Sensor with diffractive light trapping pixels

Sozo Yokogawa, Itaru Oshiyama, Harumi Ikeda, +6

Scientific Reports

Near-infrared sensitivity enhancement of a back-illuminated complementary metal oxide semiconductor image sensor with a pyramid surface for diffraction structure

Itaru Oshiyama, Sozo Yokogawa, Harumi Ikeda, +6

Photoelectric SensorCrystalline SiliconEngineeringInfrared SensorOptical Properties +11

Characterizing carrier-trapping phenomena in ultrathin SiO2 films by using the x-ray photoelectron spectroscopy time-dependent measurements

Yoshiya Hagimoto, Hiroshi Fujioka, M. Oshima, +1

Applied Physics Letters

Materials ScienceOxide HeterostructuresSemiconductor TechnologyEngineeringPhysics +11

High-Performance and Low-Power CMOS Device Technologies Featuring Metal/High-k Gate Stacks with Uniaxial Strained Silicon Channels on (100) and (110) Substrates

Y. Tateshita, J. Wang, K. Nagano, +26

Low-power ElectronicsElectrical EngineeringSemiconductor DeviceEngineeringVlsi Design +9

Characterization of carrier-trapping phenomena in ultrathin chemical oxides using x-ray photoelectron spectroscopy time-dependent measurements

Yoshiya Hagimoto, Takeshi Fujita, Kanta Ono, +4

Applied Physics Letters

EngineeringChemistrySilicon On InsulatorSi 2PElectron Spectroscopy +15

Evaluation of the Plasmaless Gaseous Etching Process

Yoshiya Hagimoto, Hajime Ugajin, Daisuke Miyakoshi, +3

Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena

EngineeringMicrofabricationSurface SciencePlasma CombustionInstrumentation +3

Extreme High-Performance n- and p-MOSFETs Boosted by Dual-Metal/High-k Gate Damascene Process using Top-Cut Dual Stress Liners on (100) Substrates

Satoru Mayuzumi, J. Wang, Shuji Yamakawa, +23

Materials ScienceSemiconductor TechnologyElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors) +12

Behavior of Bonding Strength on Wafer-to-Wafer Cu-Cu Hybrid Bonding

Shunsuke Furuse, Nobutoshi Fujii, Kengo Kotoo, +6

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

Materials ScienceMaterials EngineeringWafer Scale ProcessingThermal Stress SimulationEngineering +10

Simulation of device structure impacts on bonding wave and strain in Wafer-to-Wafer Cu-Cu Hybrid Bonding

Takaaki Hirano, Taichi Yamada, Shōji Kobayashi, +2

A 10 Gb/s high sensitivity optical receiver using an InGaAs-InAlAs superlattice APD at 1.3 mu m/1.5 mu m

Y. Miyamoto, Yoshiya Hagimoto, T. Kagawa

IEEE Photonics Technology Letters

PhotonicsOptical ReceiverHigh-speed Low-noise OperationEngineeringHigh Sensitivity +8