Huan-Neng Chen

High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

Christianto C. Liu, Shuo-Mao Chen, Feng-Wei Kuo et al. · 2012 · 125 citations

Engineering, Radio Frequency, Integrated Circuits +16

14.9 Sub-sampling all-digital fractional-N frequency synthesizer with −111dBc/Hz in-band phase noise and an FOM of −242dB

Zuow-Zun Chen, Yen‐Hsiang Wang, Jaewook Shin et al. · 2015 · 47 citations

In-band Phase Noise, Engineering, Coarser Tdc Resolution +9

A 0.54-0.55 THz 2×4 coherent source array with EIRP of 24.4 dBm in 65nm CMOS technology

Yan Zhao, Hsin‐Chia Lu, Hong-Pei Chen et al. · 2015 · 35 citations

Thz Photonics, Terahertz Technology, Engineering +19

A Millimeter-Wave CMOS Transceiver With Digitally Pre-Distorted PAM-4 Modulation for Contactless Communications

Yanghyo Kim, Boyu Hu, Yuan Du et al. · IEEE Journal of Solid-State Circuits · 2019 · 31 citations

Wireless Communications, Millimeter-wave Cmos Transceiver, Engineering +9

10.2 A 38mW 40Gb/s 4-lane tri-band PAM-4 / 16-QAM transceiver in 28nm CMOS for high-speed Memory interface

Wei-Han Cho, Yilei Li, Yuan Du et al. · 2016 · 30 citations

Tri-band Transceiver, Engineering, Vlsi Design +13