Concepedia

Byunghoon Lee

BL

Statistics

Publications

22

Citations

468

H-Index

14

Active since

2002

Affiliations

Sungkyunkwan University(Current)

Samsung (South Korea)

Nanyang Technological University

Lockheed Martin (United States)

Korea Electronics Technology Institute

Byunghoon Lee is an author at Sungkyunkwan University specializing in engineering, materials science, and applied physics.

Top concepts

EngineeringMaterial ScienceApplied PhysicsMaterials EngineeringChemistrySurface ScienceElectronic PackagingMicroelectronicsNanotechnologyChemical Engineering

Publications per year

2002–2024

22

Publications

22

Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing

Ju Seung Lee, Seung‐Ji Kang, Joo Hwan Shin et al. · Advanced Materials · 2020 · 42 citations

Engineering, Polymer Adhesive, Transfer Printing +19

Laser-Induced Graphene on Additive Manufacturing Parts

Lishi Jiao, Zhong Yang Chua, Seung Ki Moon et al. · Nanomaterials · 2019 · 41 citations · Full text

Materials Science, Chemical Engineering, Advanced Laser Processing +14

A Study on the Bonding Process of Cu Bump/Sn/Cu Bump Bonding Structure for 3D Packaging Applications

Byunghoon Lee, Jongseo Park, Seong-jae Jeon et al. · Journal of The Electrochemical Society · 2010 · 37 citations

Bonding Process, Engineering, Friction Welding +21

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Kwang‐Ho Jung, Kyung Deuk Min, Choong-Jae Lee et al. · Applied Surface Science · 2019 · 35 citations

Materials Science, Chemical Engineering, Engineering +8

Employment of a bi-layer of Ni(P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects

Byunghoon Lee, Haseok Jeon, Kee-Won Kwon et al. · Acta Materialia · 2013 · 32 citations

Materials Engineering, Materials Science, Stanene +12

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