Byunghoon Lee

Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing

Ju Seung Lee, Seung‐Ji Kang, Joo Hwan Shin et al. · Advanced Materials · 2020 · 45 citations

Engineering, Materials Engineering, Materials Science +17

Laser-Induced Graphene on Additive Manufacturing Parts

Lishi Jiao, Zhong Yang Chua, Seung Ki Moon et al. · Nanomaterials · 2019 · 44 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

A Study on the Bonding Process of Cu Bump/Sn/Cu Bump Bonding Structure for 3D Packaging Applications

Byunghoon Lee, Jongseo Park, Seong-jae Jeon et al. · Journal of The Electrochemical Society · 2010 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Kwang‐Ho Jung, Kyung Deuk Min, Choong-Jae Lee et al. · Applied Surface Science · 2019 · 36 citations

Natural Sciences, Materials Engineering, Materials Science +16

Employment of a bi-layer of Ni(P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects

Byunghoon Lee, Haseok Jeon, Kee-Won Kwon et al. · Acta Materialia · 2013 · 35 citations

Natural Sciences, Materials Engineering, Materials Science +15