S. T. Chen

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

C.‐K. Hu, L. Gignac, E. Liniger et al. · Applied Physics Letters · 2003 · 108 citations

Natural Sciences, Electrical Engineering, Materials Science +16

Atom motion of Cu and Co in Cu damascene lines with a CoWP cap

C.‐K. Hu, Lynne Gignac, R. Rosenberg et al. · Applied Physics Letters · 2004 · 42 citations

Engineering, Materials Engineering, Materials Science +14

Out-of-plane thermal expansion coefficient of biphenyldianhydride-phenylenediamine polyimide film

S. T. Chen, H. H. Wagner · Journal of Electronic Materials · 1993 · 30 citations

Natural Sciences, Chemistry, Materials Science +13

Thermal And Mechanical Properties Of Polyimide Films

S. T. Chen · MRS Proceedings · 1995 · 17 citations

Natural Sciences, Materials Engineering, Materials Science +13

Preparation and properties of mesoporous <scp>SiO₂</scp>/polyimide composite films

Xue Cui, Rongrong Zheng, S. T. Chen et al. · Polymer Composites · 2023 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +17