Nickolai Belov

Thin-layer Au-Sn solder bonding process for wafer-level packaging, electrical interconnections and MEMS applications

Nickolai Belov, T.-K. Chou, J. Heck et al. · 2009 · 35 citations

Engineering, Wafer-level Packaging, Interconnect (Integrated Circuits) +19

Silicon micro-optical scanner

Norihiro Asada, Masaru Takeuchi, V. I. Vaganov et al. · Sensors and Actuators A Physical · 2000 · 31 citations

Engineering, Microscopy, Microfabrication +7

CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device

S. Severi, J. Heck, T.-K. Chou et al. · TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference · 2009 · 21 citations

Engineering, Device Integration, Mechanical Engineering +18

Ultra-high density MEMS probe memory device

John Heck, Donald E. Adams, Nickolai Belov et al. · Microelectronic Engineering · 2009 · 16 citations

Electrical Engineering, Engineering, Microfabrication +5