Concepedia

Xingyu Dai

XD

4

Publications

119

Citations

4

H-Index

2021

Active since

Affiliations

Hunan University(Current)

Xingyu Dai is an author at Hunan University specializing in engineering, electrical engineering, and thermal engineering.

Top concepts

EngineeringElectrical EngineeringMicroelectronicsPower ElectronicsThermal EngineeringElectronic PackagingHeat TransferDevice ModelingThermal ModelingComputer Engineering

Publications per year

2021–2023

4

Publications

4

A Temperature-Dependent Cauer Model Simulation of IGBT Module With Analytical Thermal Impedance Characterization

Xin Yang, Ke Heng, Xingyu Dai et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2021 · 65 citations

Engineering, Heath Condition Monitoring, Igbt Module +16

A physical lifetime prediction methodology for IGBT module by explicit emulation of solder layer degradation

Xinlong Wu, Xin Yang, Xingyu Dai et al. · Microelectronics Reliability · 2021 · 25 citations

Electrical Engineering, Reliability Engineering, Engineering +11

Analytical modeling of thermo-mechanical stress for bond wire of IGBT module

Xingyu Dai, Xin Yang, Xinlong Wu et al. · Microelectronics Reliability · 2021 · 18 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +9

A Time-Efficient Strain-Based Lifetime Prediction Method for Bond Wires Using Vibration Fatigue Tests and Finite Element Modeling

Junjie Ye, Xin Yang, Xingyu Dai et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2023 · 11 citations

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