Ke Heng

A Temperature-Dependent Cauer Model Simulation of IGBT Module With Analytical Thermal Impedance Characterization

Xin Yang, Ke Heng, Xingyu Dai et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2021 · 65 citations

Engineering, Heath Condition Monitoring, Igbt Module +16

Distributed Thermal Modeling for Power Devices and Modules With Equivalent Heat Flow Path Extraction

Xin Yang, Siwei Xu, Ke Heng et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2023 · 45 citations

Power Engineering, Engineering, Energy Efficiency +24

A Temperature-Dependent Physical Thermal Network Model Including Thermal Boundary Conditions for SiC MOSFET Module

Ke Heng, Xin Yang, Xinlong Wu et al. · IEEE Transactions on Electron Devices · 2022 · 30 citations

Engineering, Sic Mosfet Module, Network Model +17

A 3-D Thermal Network Model for Monitoring of IGBT Modules

Ke Heng, Xin Yang, Xinlong Wu et al. · IEEE Transactions on Electron Devices · 2022 · 28 citations

Engineering, Igbt Chip, Energy Efficiency +17

Lifetime Prediction for Lift-off of Bond Wires in IGBTs Using Paris Law With Analytical Calculation of Crack Length

Xin Yang, Junjie Ye, Xinlong Wu et al. · IEEE Transactions on Power Electronics · 2023 · 16 citations