Michael Olugbenga Olorunyomi

Author

Also Known As

Michael Olorunyomi, Michael Olugbenga Olorunyomi

Publications

Citations

H-Index

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Michael Olugbenga Olorunyomi is an author at Shanghai University specializing in thermal engineering, applied physics, and electronic packaging.

#	Concept	H-Index	Publications	Citations
1	Engineering	2	2	33
2	Applied Physics	2	2	33
3	Materials Science	2	2	33
4	Mechanical Engineering	2	2	33
5	Nanomaterials	2	2	33

Michael Olugbenga Olorunyomi

Publications

Citations

H-Index

Page 1

	Year	Citations
New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging Johan Liu, Michael Olugbenga Olorunyomi, Xiuzhen Lu, 2006 1st Electronic Systemintegration Technology Conference EngineeringMechanical EngineeringThermoplastic CompositeThermal ConductivityNanoengineering	2006	23
Process and pad design optimization for 01005 passive component surface mount assembly Yu Wang, Michael Olugbenga Olorunyomi, Martin Dahlberg, Soldering and Surface Mount Technology	2007	10
New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications Wen Xuan Wang, Xiuzhen Lu, Johan Liu, EngineeringMechanical EngineeringThermal ConductivityNanoengineeringNanoelectronics	2006	10

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