Statistics
Publications
4
Citations
45
H-Index
4
Active since
1992
Affiliations
Sany (China)(Current)
N. Oyama is an author at Sany (China) specializing in 3d printing, materials science, and electronic packaging.
Publications per year
1992–2004
4
4
New packaging of chip-on-board by unique printing method
A. Okuno, K. Nagai, Ken‐ichi Ikeda et al. · 2002 · 11 citations
Advanced Packaging, Materials Science, Chip-scale Package +12
Printing encapsulation systems (PES) of advanced multichip module and COB device
Unique white LED packaging systems
A. Okuno, Yoshiteru Miyawaki, N. Oyama et al. · 2004 · 10 citations
Materials Science, Advanced Packaging, Chemical Engineering +12
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