Mari Ohfuti

Carbon nanotube via interconnect technologies: size‐classified catalyst nanoparticles and low‐resistance ohmic contact formation

Yuji Awano, Shintaro Sato, Daiyu Kondo et al. · physica status solidi (a) · 2006 · 78 citations

Catalyst Nanoparticles, Engineering, Carbon Nanotechnology +16

Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells

Mizuhisa Nihei, Daiyu Kondo, Akio Kawabata et al. · 2005 · 76 citations

Materials Science, Parallel Channel Conduction, Electrical Engineering +8

Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles

Shintaro Sato, Misato Nihei, Atsushi Mimura et al. · 2006 · 71 citations

Engineering, Novel Approach, Preformed Catalyst Nanoparticles +16

Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells [IC interconnect applications]

Misato Nihei, Daiyu Kondo, Akio Kawabata et al. · 2005 · 53 citations

Materials Science, Parallel Channel Conduction, Electrical Engineering +13

Electrical Properties of Carbon Nanotube Via Interconnects Fabricated by Novel Damascene Process

Mizuhisa Nihei, Takashi Hyakushima, Shintaro Sato et al. · 2007 · 32 citations

Engineering, Conventional Cu Interconnects, Charge Transport +21