Concepedia

EunSook Sohn

ES

Statistics

Publications

4

Citations

117

H-Index

4

Active since

2007

Affiliations

Amkor Technology (United States)(Current)

EunSook Sohn is an author at Amkor Technology (United States) specializing in stress-strain behavior, packaging engineering, and engineering.

Publications per year

2007–2021

4

Publications

4

Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level Underfill

Joonyeob Lee, Tae-Kyung Hwang, Jin‐Young Kim et al. · 2007 · 39 citations

Engineering, Systems Engineering, Condition Assessment +10

Plastic Deformation and Life Prediction of Solder Joints for Mechanical Shock and Drop/Impact Loading Conditions

Ahmer Syed, Wei Lin, EunSook Sohn et al. · 2007 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17

Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions

Ahmer Syed, SeWoong Cha, WonJoon Kang et al. · 2008 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +17

S-Connect Fan-out Interposer For Next Gen Heterogeneous Integration

Ji-Hun Lee, Gamhan Yong, Minsu Jeong et al. · 2021 · 19 citations

Engineering, Computer Engineering, High-performance Computing +17

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