David Hetzer

Fabrication of 28nm pitch Si fins with DSA lithography

Gerard M. Schmid, Richard A. Farrell, Ji Xu et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2013 · 25 citations

Engineering, Electrical Engineering, Materials Science +17

Towards electrical testable SOI devices using Directed Self-Assembly for fin formation

Chi‐Chun Liu, Cristina Estrada-Raygoza, Hong He et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2014 · 20 citations

Engineering, Manufacturing Engineering, Electronic Materials +13

Manufacturability considerations for DSA

Richard A. Farrell, Erik R. Hosler, Gerard M. Schmid et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2014 · 14 citations

Engineering, Materials Engineering, Materials Science +16

Hot melt ink technology for crystalline silicon solar cells

Tyler Williams, K. McVicker, A. Shaikh et al. · 2003 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +14

DSA patterning options for FinFET formation at 7nm node

Chi‐Chun Liu, Elliott Franke, Fee Li Lie et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2016 · 11 citations

Engineering, Materials Science, Digital Fabrication +16