Concepedia

A. Teng

AT

Statistics

Publications

2

Citations

37

H-Index

2

Active since

2001

Affiliations

Hong Kong University of Science and Technology(Current)

University of Hong Kong

A. Teng is an author at Hong Kong University of Science and Technology specializing in electronic packaging, corrosion, and microfabrication.

Top concepts

Publications per year

2001–2024

2

Publications

2

Effect of Cu stud microstructure and electroplating process on intermetallic compounds growth and reliability of flip-chip solder bump

Guowei Xiao, P.C.H. Chan, A. Teng et al. · IEEE Transactions on Components and Packaging Technologies · 2001 · 23 citations

, , +20

Unraveling Microplastic Effects on Gut Microbiota across Various Animals Using Machine Learning

Lingzi Yin, Minghao Yang, A. Teng et al. · ACS Nano · 2024 · 14 citations

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