Statistics
Publications
5
Citations
83
H-Index
5
Active since
1992
Affiliations
P. Boysan is an author at Intel (United States) specializing in materials science, materials engineering, and mechanical behavior of materials.
Publications per year
1992–2003
5
5
Role of design factors for improving moisture performance of plastic packages
S. Altimari, S. Golwalkar, P. Boysan et al. · 2003 · 21 citations
Solder joint reliability of a thin small outline package (TSOP)
John H. Lau, S. Golwalkar, P. Boysan et al. · 2003 · 17 citations
Natural Sciences, Materials Engineering, Materials Science +14
Moisture sensitivity of thin small outline packages
S. Golwalker, P. Boysan, R. Foehringer et al. · 2002 · 12 citations
D.M. Noctor, F.E. Bader, A.P. Viera et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 12 citations
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