S. Ledain

An efficient room-temperature silicon-based light-emitting diode

Wai Lek Ng, M. A. Lourenço, R. Gwilliam et al. · Nature · 2001 · 640 citations

Engineering, Electrical Engineering, Materials Science +11

Passive and heterogeneous integration towards a Si-based System-in-Package concept

F. Roozeboom, A.L.A.M. Kemmeren, J.F.C. Verhoeven et al. · Thin Solid Films · 2005 · 58 citations

Engineering, Computer Engineering, Systems Engineering +14

Surface potential mapping of biased pn junction with kelvin probe force microscopy: application to cross-section devices

Aziz Doukkali, S. Ledain, C. Guasch et al. · Applied Surface Science · 2004 · 49 citations

Engineering, Electrical Engineering, Materials Science +17

A 65-nm-CMOS 100-MHz 87%-efficient DC-DC down converter based on dual-die system-in-package integration

Henk Jan Bergveld, K. Nowak, Ravi Karadi et al. · 2009 · 49 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

A Mo(V) Monophosphate with an Original Tridimensional Framework: Li2Na(MoO)2(PO4)3

S. Ledain, A. Leclaire, M.M. Borel et al. · Journal of Solid State Chemistry · 1997 · 18 citations

Natural Sciences, Chemistry, Materials Science +9