Measurement of electron-impact excitation cross sections out of metastable levels of argon and comparison with ground-state excitation

John B. Boffard, Garrett A. Piech, Mark Gehrke, +2

Physical Review A

Excitation Cross SectionsEngineeringNuclear PhysicsPlasma PhysicsIon Beam Instrumentation +15

Measurement of Cross Sections for Electron Excitation out of the Metastable Levels of Argon

Garrett A. Piech, John B. Boffard, Mark Gehrke, +2

Physical Review Letters

Excitation Cross SectionsMetastable LevelsEngineeringCross SectionsPhysics +13

Development of substrates for through glass vias (TGV) for 3DS-IC integration

Aric Shorey, Scott Pollard, A. A. Streltsov, +2

EngineeringDevice IntegrationIntegrated CircuitsInterconnect (Integrated Circuits)Through-substrate Vias +19

Monolithically Integrated Micro- and Nanostructured Glass Surface with Antiglare, Antireflection, and Superhydrophobic Properties

Domenico Tulli, Shandon D. Hart, Prantik Mazumder, +6

ACS Applied Materials & Interfaces

Materials ScienceSelf-cleaning SurfaceChemical EngineeringEngineeringHierarchical Micro- +10

Fabrication of 3D-IC interposers

John Keech, Satish C. Chaparala, Aric Shorey, +2

EngineeringIntegrated CircuitsCost-effective SolutionsWafer Scale ProcessingAdvanced Packaging (Semiconductors) +16

Electron impact excitation out of the metastable levels of argon into the level

John B. Boffard, Garrett A. Piech, Mark Gehrke, +3

Journal of Physics B Atomic Molecular and Optical Physics

Metastable LevelsEngineeringPhysicsElectron SpectroscopyNatural Sciences +10

Thin glass substrates development and integration for through glass vias (TGV) with Cu interconnect

Bor Kai Wang, Yi‐An Chen, Aric Shorey, +1

EngineeringIntegrated CircuitsThin GlassInterconnect (Integrated Circuits)Wafer Scale Processing +19

Electron excitation out of the metastable level of He into high-<b><i>n</i></b>triplet levels

Garrett A. Piech, J. Ethan Chilton, L. W. Anderson, +1

Journal of Physics B Atomic Molecular and Optical Physics

Charge ExcitationsEngineeringNuclear PhysicsComputational ChemistryChemistry +19

Coherent frequency-selective polarimeter for polarization-mode dispersion monitoring

I. Roudas, Garrett A. Piech, Michal Mlejnek, +3

Journal of Lightwave Technology

PhotonicsCoherent Frequency-selective PolarimeterCoherent DetectionEngineeringPolarization Imaging +11

Thin glass substrates development and integration for through glass vias (TGV) with copper (Cu) interconnects

Bor Kai Wang, Yi‐An Chen, Aric Shorey, +1