Szu-Chun Wang

Post-weld-shift in dual-in-line laser package

Jao-Hwa Kuang, Maw-Tyan Sheen, Szu-Chun Wang et al. · IEEE Transactions on Advanced Packaging · 2001 · 43 citations

Engineering, Materials Engineering, Materials Science +16

Effect of Au thickness on laser beam penetration in semiconductor laser packages

Wood-Hi Cheng, Szu-Chun Wang, Sien Chi et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 24 citations

Engineering, Materials Engineering, Materials Science +16

Fiber alignment shift formation mechanisms of fiber-solder-ferrule joints in laser module packaging

Wood-Hi Cheng, Maw-Tyan Sheen, Gow-Ling Wang et al. · Journal of Lightwave Technology · 2001 · 23 citations

Natural Sciences, Materials Engineering, Materials Science +16

Crack formation mechanism in laser-welded Au-coated Invar materials for semiconductor laser packaging

Jao-Hwa Kuang, Maw-Tyan Sheen, Szu-Chun Wang et al. · IEEE Transactions on Advanced Packaging · 1999 · 14 citations

Engineering, Materials Engineering, Materials Science +17