A. Seekamp

Driving force for Sn whisker growth in the system Cu–Sn

M. Sobiech, U. Welzel, E. J. Mittemeijer et al. · Applied Physics Letters · 2008 · 107 citations

Natural Sciences, Materials Engineering, Materials Science +17

Local, submicron, strain gradients as the cause of Sn whisker growth

M. Sobiech, M. Wohlschlögel, U. Welzel et al. · Applied Physics Letters · 2009 · 103 citations

Natural Sciences, Materials Engineering, Materials Science +17

The Microstructure and State of Stress of Sn Thin Films after Post-Plating Annealing: An Explanation for the Suppression of Whisker Formation?

M. Sobiech, U. Welzel, Roman Schuster et al. · 2007 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +17

Whisker mitigation measures for Sn-plated Cu for different stress tests

Linda Sauter, A. Seekamp, Yasufumi Shibata et al. · Microelectronics Reliability · 2010 · 15 citations

Natural Sciences, Materials Engineering, Materials Science +5