M. Sobiech

Driving force for Sn whisker growth in the system Cu–Sn

M. Sobiech, U. Welzel, E. J. Mittemeijer et al. · Applied Physics Letters · 2008 · 106 citations

Materials Engineering, Materials Science, Surface Characterization +12

Local, submicron, strain gradients as the cause of Sn whisker growth

M. Sobiech, M. Wohlschlögel, U. Welzel et al. · Applied Physics Letters · 2009 · 103 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +17

Stress Relaxation Mechanisms of Sn and SnPb Coatings Electrodeposited on Cu: Avoidance of Whiskering

M. Sobiech, John Lorenz Lawrence Teufel, U. Welzel et al. · Journal of Electronic Materials · 2011 · 36 citations

Materials Engineering, Materials Science, Snpb Coatings Electrodeposited +7

Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics

M. Sobiech, Carmen Krüger, U. Welzel et al. · Journal of materials research/Pratt's guide to venture capital sources · 2011 · 32 citations

Materials Science, Interface Property, Engineering +8

Thermal conductivity of hard oxynitride coatings

P. H. Michael Böttger, Erik Lewin, Jörg Patscheider et al. · Thin Solid Films · 2013 · 23 citations

Materials Science, Engineering, Thermal Barrier Coating +3